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发明名称
ELECTROLESSLY SOLDER PLATING COMPOSITION
摘要
申请公布号
GB2228269(B)
申请公布日期
1993.05.05
申请号
GB19900001530
申请日期
1990.01.23
申请人
* OKUNO CHEMICAL INDUSTRIES CO. LTD
发明人
YUKIO * NISHIHAMA;AKEMI * OHARADA
分类号
C23C18/48;H05K3/34
主分类号
C23C18/48
代理机构
代理人
主权项
地址
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