COOLING STRUCTURE FOR INTEGRATED CIRCUIT,申请号JP19910270605-传众专利搜索

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发明名称	COOLING STRUCTURE FOR INTEGRATED CIRCUIT
摘要
申请公布号	JPH05109953(A)	申请公布日期	1993.04.30
申请号	JP19910270605	申请日期	1991.10.18
申请人	NEC CORP	发明人	SANO TOSHIFUMI
分类号	H01L23/473	主分类号	H01L23/473
代理机构		代理人
主权项
地址

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