发明名称 SOLDERING APPARATUS
摘要 PURPOSE:To enable partial soldering and to improve soldering workability by making the opening part area to a shutter mechanism part according to the soldering supplying area to a printed board changeable. CONSTITUTION:A soldering apparatus is incorporated in an apparatus box body 15 and in the inner part thereof, a fin 16 driven with a motor 6 for solder jet is arranged and at the upper part thereof, a solder pot 3 forming a nozzle 1 for spouting up the solder is arranged and above the nozzle 1, the shutter mechanism part 4 is arranged. The shutter mechanism part 4 is constituted as changeable to the area of the opening part 17 and a shutter driving part 10 for changing the opening part 17 area is provided by driving the shutter mechanism part 4. Further, above the shutter mechanism part 4, holding mechanism 8 for the printed board 5 is arranged, and by driving the holding mechanism 8, the soldering position is positioned above the opening part 17 of the shutter mechanism part 4, and by bringing this into contact with the solder 2 spouted from the opening part 17, this position is selectively soldered.
申请公布号 JPH05104241(A) 申请公布日期 1993.04.27
申请号 JP19910260724 申请日期 1991.10.08
申请人 PFU LTD 发明人 SASAKI KATSUNAO
分类号 B23K1/08;B23K101/42;H05K3/34 主分类号 B23K1/08
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