| 摘要 |
PURPOSE:To prevent a transparent electrode, a semiconductor layer, and a back metal electrode from being corroded when a first resin layer is exfollated from a glass substrate. CONSTITUTION:In the manufacturing method for a photoelectromotive device wherein a first resin layer 4 possessing insulation characteristics and resilience, a transparent first electrode 5, a thin-film semiconductor layer 6 containing a photoactlve layer, a second electrode layer T, and a second resin layer 8 possessing insulation characteristics and resilience are laid on one major surface of a supporting substrate 1, orderly from the substrate, one over another, and then the first resin layer 4 is exfollated from the supporting substrate 1, at least one major surface of the supporting substrate is subjected to impurity removal processes. |
