SEMICONDUCTOR MOLD FORMING METHOD

摘要

PURPOSE:To improve the quality of a semiconductor by preventing the deformation of a die pad in the internal part of semiconductor package and by reducing the internal voids in the mold forming method of a semiconductor element. CONSTITUTION:The shape of the gate 3 of the title mold is tapered in such a manner that the flow-in direction of fused resin is directing toward the side having a larger quantity of resin filler between the upper and the lower cavities of a lead frame 2.