发明名称 METHOD AND APPARATUS FOR SEWING UP INTERNAL LAYER PRINTED CIRCUIT BOARDS
摘要 PURPOSE:To avoid position discrepancy between printed circuits by a method wherein the vertical movements of two or more machine needles which sew both the side parts of the printed circuit boards simultaneously are synchronized with each other and, while the machine needles are lifted from both the side parts, both the side parts are fed by one sewing pitch with a same speed. CONSTITUTION:The side surfaces of a positioning jig plate 1 which fixes inner layer printed circuit boards 6 are brought into contact with two metal guides 7. Both the two metal guides 7 are linear metal plate and are laid in parallel with both the sides of the positioning jig plate along a direction perpendicular to their cross sections and guide the positioning jig plate 1 with which they are brought into contact along a sewing direction. A pair of feeding rollers 8 are brought into contact with both the sides of the lower surface of the positioning jig plate 1 and feeds the inner layer printed circuit boards 6 by one sewing pitch while machine needles 9 are lifted from the inner layer printed circuit boards 6. With this constitution, when the sewn inner layer printed circuit boards are heated and pressed, the position discrepancy between the printed circuits can be avoided.
申请公布号 JPH05102673(A) 申请公布日期 1993.04.23
申请号 JP19910283511 申请日期 1991.10.03
申请人 SUMITOMO BAKELITE CO LTD 发明人 AZUMA KEIJI;KURIHARA MASAKI;YAMANAKA MASAO
分类号 B32B7/08;H05K3/46 主分类号 B32B7/08
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