| 摘要 |
PURPOSE:To form a lead having a minute pitch by a method wherein an electrode of a semiconductor chip is connected to a tip of a lead frame inner lead, a coupling part is cut by laser-machining, and each inner lead is electrically made independent. CONSTITUTION:A tip of a lead frame inner lead 4 is thinned to form a plate- thinned part 4a, and further a coupling part 4b is provided at a tip of the lead frame inner lead 4. A TAB outer lead 2b of a TAB chip and the lead frame inner lead 4 are performed thermocompression bonding, and the TAB chip after a semiconductor chip is mounted is mounted W a lead frame 7. Next, the coupling part 4b is cut by using a laser to separate the lead frame inner lead 4 and electrically made independent each other. Thus, the tips of the lead frame inner leads can minutely be processed and the leads can be connected at narrow lead pitches. |
