| 摘要 |
<p>A curved lead (14) provides a mechanical and electrical connection between a board contact (21) on a circuit board (20) and a chip contact (16) associated with a circuit chip (18). The chip (18) can be mounted to the circuit board (20), to a chip carrier (12) or to a multiple-chip module (90). The curved lead (14) is substantially entirely plated with solder and is formed of a single piece of conductive material (56). The curved lead (14) has a first surface (58) for connection to the chip contact (16) and a second surface (60), generally parallel to the first surface (58), for connection to the board contact (21). The first and second surfaces (58, 60) are connected by at least one curved portion and are arranged to mount the circuit chip (18) to the circuit board (20) with the solder in a compliant, generally parallel arrangement substantially free of stress.</p> |
