| 摘要 |
PURPOSE:To increase mechanically the adhesion strength between resin and the tab of a semiconductor device in which the tab is molded and sealed with the resin along with a plurality of leads, avoid peeling-off of the adhering part and avoid crackings in the resin positively and improve reliability such as moisture-resistant properties by providing lattice-form trenches on the back surface of the tab. CONSTITUTION:A tab 13 and leads 14 are made of material such as Kovar or alloy-42 whose thermal expansion coefficient is approximately 0.5X10<-5>/ deg.C. Trenches 17 are formed in a lattice-form on the back surface of the tab 13 and a part 15a of molding resin is made to penetrate into the trenches 17 and cured. The tab 13 and the resin 15 are mutually bonded into one-piece. The horizontal movement of the resin 15 relative to the tab 13 is restricted mechanically so that, even if there is a difference in thermal expansion coefficients between the tab 13 and the resins 15, slippage and contraction of the resin caused by the peeling-off of the adhering part between the tab 13 and the resin 15 can be avoided and the stress concentration near the tab can be avoided. |
