Substrate cleaner using ultrasonics - has inner container with substrate supported in cleaning chemicals within outer container of ultrasonic carrier medium

摘要

The appts. to clean a substrate, such as a semiconductor wafer, has a carrier (21) to support the substrate (4) to be cleaned within a container (2) filled with cleaning chemicals (19). An outer container (9) is filled with an ultrasonic carrier medium (8) surrounding the inner cleaning container (2). An ultrasonic oscillator (7) is applied to the outer wall of the outer container (9) to deliver ultrasonic waves to the substrate (4) within the inner container (2). Pref. the carrier has at least two components, supporting the substrate (4) from below, without blocking the ultrasonic waves. A fillet at the carriers holds the susbtrate (4) in place, and an outer wall of the outer container (9) is pitched to form an angle of 90 deg. pitched to reflect all the ultrasonic waves through the substrate (4), or one side wall of the inner container (2) has a wedge shape, or a stepped wedge formation. ADVANTAGE - The whole surface of the semiconductor wafer is cleaned effectively and consistently.