| 摘要 |
PURPOSE:To provide an electronic circuit module which can remarkably reduce an interval between lead leg pitches to realize highly density mounting in a surface-mounted electronic circuit module for making electric connection with a mother board by means of lead legs. CONSTITUTION:A holding groove 12 to which a vertical intermediate part of a lead leg 13 which is bent in a crank is fitted is provided on a side wall 10 of a cover body 8 which has been formed so that a peripheral upper face of a circuit board 2 can be supported and fitted from downward, while a board connection 13b which holds the crank-like intermediate part in the holding groove 12 and also extends bending from the upper end of the intermediate part inward is inserted into an insertion hole 14 which is formed through a bottom wall of the holding groove 12. On the other hand, a peripheral part of the circuit board 1 is held between the inner end board connection 13b of the lead leg 13 protruding from an inner face of the side wall 10 of the cover body 8 and the cover body 8. |
