| 摘要 |
PURPOSE:To enable a plating liquid to well circulate and substitute, to uniformly stick to the internal surface of a blind hole for BVH, and to easily degas by performing BVH plating in such a way that a substrate with the blind hole for BVH is dipped in a plating bath with the side edge of the substrate in the vertical direction so that a plating liquid flow can collide with the blind hole in the horizontal or an oblique direction. CONSTITUTION:A multilayered board composed of an insulating layer 1, internal- layer circuit 2, metallic foil 3, etc., is manufactured by integrally piling up an internal-layer material, base material impregnated with a resin, outermost- layer metallic foil, etc. A blind hole 5 for BVH is formed together with or separately from a through-hole. Then a substrate 6 with the blind hole 5 is dipped in an electroless or electrolytic plating liquid 7 with its side edge 8 in the vertical direction. As a result, the hole 5 is aligned in the horizontal direction. Under such condition, the plating liquid 7 is flowed into the hole 5 in the horizontal or an oblique direction. Because of the liquid flow, the plating liquid circulates in the hole 5 by convection and substitution is smoothly carried out. |
