| 摘要 |
PURPOSE:To strengthen the adhesion strength of a shield layer and a resin layer formed on the external side of the former by forming the shield layer of copper in the external side of an insulating layer in the outside of a wire's core wire and coating the surface with a copper oxide coating layer. CONSTITUTION:A wire's core wire 1 is coated with an insulating layer 2 and a 5-10mum thick copper shield layer 3 is formed by electroless copper plating. In the case that the insulating layer 2 is polyimide-, polyamideimide-based resin, the surface is roughened by an aqueous solution of NaOH in 40g/l before copper plating to heighten the adhesion strength to the copper coating layer. In the case that the insulating layer 2 is fluororesin, the surface is roughened using an exclusively used solution. Then, the resulting body is coated with a copper oxide film 4 by using a mixed solution of sodium chlorite and sodium hydroxide and then the surface is roughened by 200nm to 1mum. The most external side is coated with a protective layer 5 of polyimide-based thermosetting resin. |
