发明名称 |
Method and apparatus for back side damage of silicon wafers |
摘要 |
A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.
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申请公布号 |
US5197271(A) |
申请公布日期 |
1993.03.30 |
申请号 |
US19810674822 |
申请日期 |
1981.03.22 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ROBBINS, JOHN;BOSTON, RICKY L. |
分类号 |
H01L21/304;H01L21/322 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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