| 摘要 |
PURPOSE:To accurately align a reduction stepper without lowering its throughput by performing die-by-die exposure only on wafers on which nonlinear deviations occur in such a way that the die-by-die exposure is performed when remaining errors become larger than allowable values and global exposure is performed in accordance with measured results when the remaining errors are lower than the allowable values. CONSTITUTION:An aligning exposing device measures the position of the shot of a wafer as fine alignment after performing pre-alignment and search alignment. Each correcting amount of shift, scaling, rotation, and orthgonality which causes a deviation from ideal coordinates is calculated from the measured results of the position. At the time of calculation, remaining errors Rx and Yy which are not included in the correcting amounts are also calculated simultaneously. When the errors Rx and Yy are lower than allowable values, global exposure is performed with the correcting amounts and, when the errors exceed the allowable value, die-by-die exposure is performed. Therefore, alignment can be performed with high accuracy without lowering the throughput. |
