| 摘要 |
An assembly for mounting a heat-generating semiconductor to an associated heat sink whereby direct heat conducting contact is assured between the semiconductor body and the heat sink by an element which electrically isolates and insulates the semiconductor from the other components while at the same time locating and providing pressure to clamp the semiconductor on the heat sink. The present assembly provides good thermal contact and adapts to thermal expansion of the system during operation to assure the maintainance of the contact regardless of temperature changes within the device. The assembly comprises a heat-dissipating base element having plan dimensions which are larger than the plan dimensions of the semiconductor. A retainer member is formed of a dielectric material and has means for locating and retaining the semiconductor. The retainer member also includes a plurality of arms connected to the locating and retaining means. The relative thicknesses of the semiconductor locating and retaining means and the semiconductor, and the positioning of the arms with respect thereto, are such that the ends of the arms are deflected when the retainer member is connected to the base element to force the semiconductor and the base element into intimate heat transmitting contact. Further means is provided for connecting the base element and the arms of the retainer member. |
