| 摘要 |
PURPOSE:To enable testing of characteristic of a chip accurately and easily with the chip mounted on the apparatus by mounting the chip on the surface of a wiring substrate where a wiring pattern mountable on the apparatus directly and a connection land for testing chips are formed. CONSTITUTION:A unit 11 to be tested has a chip 2 bonded with an adhesive 3 on the surface of a wiring substrate 11-1 where a wiring pattern mountable on the apparatus directly and a connection land 11-1a for testing chips are formed. An adaptor printed board 12 has other electronic components 4 than the chip 2 mounted on a wiring substrate 12-1 where a wiring pattern and a connection land 12-1a the same as those of the unit 11 to be tested are formed. The connection land 11-1a of the unit 11 to be tested is connected to the connection land 12-1a of the adaptor printed board 12 with a plurality of probe pins 13-2 containing a spring of the connection printed board 13. This enables the yielding of the same functions as those of a printed board unit mounted on the apparatus with the chip 2 and various electronic components 4 thereby achieving a testing of the chip 2 accurately as specified. |
