AUTOMATIC REFLOW-SOLDERING DEVICE

摘要

PURPOSE:To prevent the warping of a substrate by performing a soldering process on a substrate while the substrate is carried through an entire process in such a state where the substrate is placed on and supported by a plurality of warp preventing supports mounted on a carrier. CONSTITUTION:A substrate 14 is carried in the direction A by means of a substrate carry-in conveyor 35 and positioned to a prescribed position while the substrate 14 is supported by substrate guides. A carrier (CA) 2 is raised in the direction B by means of a carrier raising device 5. A positioning guide 3 fixed to the CA 2 is inserted through the substrate 14. Warp preventing supports 4 support the lower surface of the substrate 14. The CA 2 and substrate 14 are carried in the direction A and delivered onto a main conveyor 36 on which the substrate 14 is preheated. As a result, cream solder is melted and electronic components are soldered to prescribed places on the substrate 14. After soldering, the substrate 14 is lowered by means of a carrier lowering device 8. The positioning guides 3 of the CA 2 come out from the substrate 14 and only the CA 2 is lowered. The substrate 14 is carried out through a carrying-out port 40b. The CA 2 is carried in the direction F and delivered onto a return conveyor 9.