LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To remarkably improve reliability of semiconductor by obtaining excellent corrosion resistance. CONSTITUTION:A lead frame material has a Cu series plated layer 15, an Ni series plated layer 9 on the upper layer, and at least inner and outer leads of a lead frame have Pd plated or Pd alloy plated layers 16. Thus, its corrosion resistance is remarkably improved as compared with that of Pd plated or Pd alloy plated lead frame of a conventional structure, and reliability of semiconductor is remarkably improved.