发明名称 MODULAR PAD ARRAY INTERFACE
摘要 <p>A leadless component socket (10) comprises a one- or two- piece leadless component contact socket assembly (12) having a plurality of holes (30) with a respective plurality of spring contacts (46, 50) disposed therein. The socket assembly includes a finger slot (41) or slots to facilitate the manual removal of a chip carrier (14) from the socket and a bias clip (40) and integral keyed corner (36) for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover (64), a cover support (66), an insulator assembly (26) and a backup plate (28) or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed.</p>
申请公布号 WO1993004512(A1) 申请公布日期 1993.03.04
申请号 US1992005615 申请日期 1992.07.02
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