发明名称 LEAD-BASED SOLDER ALLOY AND ITS USE IN SOFT SOLDERING
摘要 <p>Wave soldering of electronic component in particular if carried out in a substantially oxygen-free inert atmosphere utilising a quaternary solder alloy consisting of 1 to 15 wt% tin, 1 to 13 wt% antimony, 1 to 15 wt% bismuth with the balance being lead.</p>
申请公布号 WO1993003884(A1) 申请公布日期 1993.03.04
申请号 GB1992001459 申请日期 1992.08.06
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