摘要 |
<p>A method and apparatus for automatically laminating, under heat, vacuum and mechanical pressure, a printed circuit board (132) or the like. The apparatus includes a two-part conveyorized vacuum applicator comprising two input conveyors (14, 16) in end-to-end relation and a belt conveyor (20) and vacuum laminator (22). The belt conveyor is characterised in its use of an endless belt (50) having an aperture (84) therein through which, in the vacuum laminating condition of the applicator, a movable lower platen (90) is movable upwards into sealing contact with an upper platen (92), with the printed circuit board to be laminated and a portion of the upper run (50a) of the endless belt contained within the vacuum chamber of the laminator. <IMAGE></p> |