| 摘要 |
PURPOSE:To contrive to enhance reliability of sealing of a glass sealed package by a method wherein a groove is provided to an insulating substrate at the part having a short sealing path to extend the path, and a glass material is buried in the part thereof moreover to increase the glass material at the sealing part. CONSTITUTION:A groove 18 is provided at the periphery of a cave 12 at the center of an insulating substrate 11 to be buried with a glass material 13, and then the glass material 13 is formed uniformly on the whole surface of the substrate 11 excluding the cave. Outside leads 17 are equipped, a semiconductor element 14 is fixed to the cave 12, and wiring is performed. A groove 19 is formed also to a cap material 16 to be buried with the glass mterial 13, the glass material 13 is formed uniformly and wholly on the surface of the cap to face with the substrate, and the substrate 11, the leads 17 and the cap 16 are sealed. Because the groove is provided at the periphery of the cave, stress applied to the sealed part from the outside leads is relieved by the glass material, and even when the cave is formed large, and a large type element is loaded, deterioration of reliability is not generated, and the high reliable glass sealed package can be obtained. |
