| 摘要 |
PURPOSE:To obtain the photosensitive resin composition superior in adhesion to a substrate subjected to fluoric acid treatment and inorganic passivation and further even after humidity treatment by incorporating a specified aminoacrylate compound and a specified sensitizer in a specified polyamic acid solution. CONSTITUTION:This photosensitive resin composition is prepared by allowing an aromatic diamine compound represented by formula I to react with tetracarboxylic dianhydride represented by formula II in an amido compound having a C=C double bond polymerizable by chemically active rays to prepare the polyamic acid solution dissolved in the polyamido compound, and incorporating the aminoacrylate compound represented by formula III and the sensitizer having a maximum absorption wavelength of 330-500nm in the polyamic acid solution in the amido compound solvent. In formulae I-III, R1 is an aliphatic or aromatic group; X is H or methyl; and Y is methyl or ethyl. As the aromatic diamine, 1,3 bis(3-aminophenoxy)benzene and the like are enumerated, thus permitting adhesion with semiconductor chips to be enhanced by using these diamines and therefore a semiconductor manufacture process to be shortened. |
