| 摘要 |
<p>PURPOSE:To make it possible to separate satisfactorily each semiconductor chip diced on a dicing table at regular intervals without producing damage or fragments on the surface of a semiconductor wafer by cutting fully the semiconductor wafer. CONSTITUTION:A semiconductor wafer 6 is full-cut-diced on a dicing table 4 where the wafer is divided into each semiconductor chip 6a. The dicing table 4 on which the semiconductor wafer 6 is mounted is designed to extend in proportion to the amount of depression of a pressure plate 30. The distances between semiconductor chips 6a bonded thereon after diced, are increased. Then, the downward movement of an outer ring holder 34 forces an outer ring 36 to fit into the outside of an inner ring 28 where a dicing tape 4 is clamped in between so that a second stage-elongation operation is carried out. The semiconductor chips 6a are placed in a state where they are separated from each other at specified intervals. This construction makes it possible to protect the surface of the diced semiconductor chips from defects or fragments.</p> |
