| 摘要 |
PURPOSE:To enable to produce a semiconductor device with stable quality and high reliability by a method wherein a lead frame buffer magazine driven to make a lead frame retractable upward as well as a belt conveyer to feed the lead frame to the magazine are provided between a manufacturing unit and another. CONSTITUTION:A lead frame 11 dies-bonded on a dies-bonder unit 20 is intermittently fed pitch by pitch to the first sensor 102 by a pitch feeding mechanism along a guardrail 105 guided by positioning holes made on both sides of the guardrail 105. During the feeding process, the first stopper 109 is lifted by sensing signals transmitted from the first sensor 102. Then an endless belt 111 is driven by means of driving the first motor 106 to store the lead frame 11 fed by the pitch feeding mechanism in a buffer magazine 123. At this time, the head of lead frame 11 abuts against the first stopper 109 to be stopped. |
