| 摘要 |
PURPOSE:To provide a method of improving adhesivity between metal conductor circuit and an insulating layer in a multilayer printed wiring board. CONSTITUTION:In a method of manufacturing a multilayer printed wiring board, the entire part of a part of an insulated substrate 1 providing metal conductor circuits is coated with an ultraviolet setting composition 3 containing inorganic solid powder, it is then patterned to form an insulating layer 4, thereafter plasma processing is conducted and the insulating layer 4 is roughened with an inorganic acid and thereafter nonelectrolytic plating is conducted. |
