发明名称 WAFER CHUCK
摘要 <p>PURPOSE:To enhance durability, to prevent the contamination of a wafer by surface exfoliation, to prevent deterioration in plane correction of the wafer caused by adhesion of foreign substance using ceramic made by impregnating Si with SiC, as the material of a chuck, and to cut down the cost of the title wafer chuck. CONSTITUTION:The surface of a wafer is prevented from becoming irregular because the cavity parts are filled up with Si. Accordingly, as no foreign substance enters, the plan correction of the wafer can be maintained. Also, by using the Si material same as the wafer material, the wafer is not contaminated even when SiC 10 adheres to the wafer, because Si is diffused in the following process. Also, as SiC is used as the main material of chuck, it has higher degree of hardness than the wafer, it has excellent overall flatness. As a result, durability can be enhanced, the contamination of the wafer due to surface exfoliation can be prevented, the deterioration of plane correction of the wafer by the adhesion of foreign substance can be prevented, and at the same time, cost can be reduced.</p>
申请公布号 JPH0536818(A) 申请公布日期 1993.02.12
申请号 JP19910210444 申请日期 1991.07.29
申请人 CANON INC 发明人 KUBO HIROYOSHI
分类号 H01L21/30;G03F7/20;H01L21/027;H01L21/683 主分类号 H01L21/30
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