| 摘要 |
The semiconductor chip module comprises a substrate (6) on which a wiring portion is formed, a semiconductor chip (4) mounted so as to face a circuit side up to the wiring portion, a heat sink (3, 3a, 13) with one end thereof contacted to the central portion of an upper surface of the semiconductor chip (4, 4a); and a cap (2) which has an opening (2a) for exposing the other end of the heat sink (3, 3a, 13) to the outside thereof, the cap (2) enclosing all of the semiconductor chips (4, 4a). Accordingly, the heat generated from the semiconductor chips (4, 4a) can be dissipated through the heat sink (3, 3a, 13) to the outside. It results in providing a semiconductor chip module without inconvenience for operation with high speed. |
