| 摘要 |
An electrical component placing apparatus having a rotary head is required to be further accelerated to place an electrical component. In order to accelerate the operation of the placing apparatus, the indexing speed of the rotary head must be accelerated. However, since the rotary head is heavy, its rotating inertial is large. Thus, when the indexing speed of the rotary head is accelerated, a vibration at the time of stopping indexing of the rotary head is increased as well. Therefore, mistakes of picking up the electrical component by the pick and place head and placing the electrical component on the substrate occur. This invention reduces the outer diameter of a rotor for indexing a pick and place head smaller than the diameter of a guide for guiding the indexing of a pick and place head, disposes a bracket for supporting the pick and place head along the wall surface of the rotor and reduces the rotating diameter of the pick and place head smaller than the diameter of the guide. With the arrangement described above, the rotary head is reduced in size to largely reduce its weight and to reduce the rotary inertia of the rotary head. Therefore, the rotary inertia of the rotary head is reduced, and the vibration of the pick and place head at the time of indexing is reduced. Consequently, the rotary head can be indexed at a high speed, thereby placing the electrical component on the substrate at a high speed.
|
