| 摘要 |
PURPOSE:To provide a ceramic multilayer wiring board capable of preventing the generation of insulation degradation which may be caused by leakage pass or the formation of a through hole and protecting the board from potential insulation breakdown and its manufacturing method. CONSTITUTION:A ceramic multilayer wiring board comprises a first insulation layer 14a and a second insulation layer 20 in structure where the second insulation layer 20 is installed between the first insulation layer 14a and a surface conductor layer 30 separately added to the upper layer of the first insulation layer 14a and sintered at a burning temperature identical to or lower than that of the first insulation layer 14a at a different period. In addition, the lamination structure is available from a manufacturing method which laminates and sinters insulation paste on the first insulation layer 14a of the ceramic multilayer wiring board and laminates the second insulation layer 20 where the insulation paste uses an insulation material to be sintered at a temperature equivalent to or lower than that of the first insulation layer 14a. The ceramic multilayer wiring board and its manufacturing method makes it possible to seal voids and inhibit the communication of leakage pass. |
