| 摘要 |
<p>PURPOSE:To further increase the mounting density of a board by reducing an absorbing pad which absorbs dimensional variability resultant from the contraction of a ceramic multilayer wiring board. CONSTITUTION:In a mounting board which forms a minute cover pattern which mounts electronic components, such as LSI on a multilayer wiring board obtained by laminating and sintering collectively green sheets, a pitch P2 of a through hole 5 on the multilayer wiring board 11 is measured and an electronic component mounting pattern is formed by an aligner based on as stepper system in accordance with the measured pitch P2.</p> |
