发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To obtain a multilayer printed wiring board which improves a pattern holding power and a component mounting and holding power. CONSTITUTION:In a multilayer printed wiring board which consists of a plurality of laminated printed wiring boards 3a to 3e, a penetration through-hole is formed in blind through-holes 1a and 1b.
申请公布号 JPH0529767(A) 申请公布日期 1993.02.05
申请号 JP19910202164 申请日期 1991.07.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAZAKI RYOICHI;ARAI HIDEAKI
分类号 H05K3/46 主分类号 H05K3/46
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