| 摘要 |
PURPOSE:To enhance conductivity and to improve flexing resistance by increasing adhesive properties of a jumper circuit, a through-hole circuit and an electromagnetic wave shield to a circuit pattern. CONSTITUTION:A circuit pattern is formed of a copper alloy rolled and annealed foil containing Fe, P, containing at least one type or more of substances of In, Sn, Pb and Sb and the residue of copper. An electromagnetic wave shield 7 and a jumper circuit 6 are formed of titanate-coated copper particles, resol type phenol resin, chelate layer forming agent, adhesive property improving agent, and conductivity improving agent are mixed. Through-hole circuits 5a, 5b are formed of conductive paint including titanate-coated copper particles, resol type phenol resin, amino compound, and chelate layer forming agent. |
