ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE AND ADHESIVELY BONDED STRUCTURE THEREWITH

摘要

A device is proposed to detect firm and reliable adhesive bonding and electrical connection between electrode arrays on two circuit boards by sandwiching a layer of an anisotropically electroconductive adhesive composition, in which the adhesive composition is formulated with an epoxy resin capable of changing color by complete curing and at least one of the circuit boards is prepared of a substrate having an opening or made from a transparent material in the vicinity of the electrode array so as to facilitate visual see-through inspection of the adhesive layer to detect complete curing of the adhesive composition.