发明名称
摘要 PURPOSE:To improve the workability by simultaneously soldering upon bonding of a conductor pattern on a circuit board of a coil lead, thereby bonding fixedly the coil to the board. CONSTITUTION:A temporary adhesive for temporarily stopping a coil 3 is coated or printed on a circuit board 2, and cream solder is then coated or printed on conductors 10, 11 and further a conductor pattern 21. Then, coil leads 8, 9 and conductors 10, 11 are positioned, the core wire exposing portion 20 of the coil is disposed on the pattern 21 to mount the coil 3 on the board 2. When then heated, the leads 8, 9 are soldered to the conductors 10, 11, and the portion 20 is soldered to the pattern 21.
申请公布号 JPH056422(B2) 申请公布日期 1993.01.26
申请号 JP19830189778 申请日期 1983.10.11
申请人 SONY CORP 发明人 HAYASHI TSUNEYUKI;ISHIHARA YOSHIMI
分类号 H02K15/04;H01F5/04;H01F7/06;H02K3/46;H05K1/18;H05K3/34 主分类号 H02K15/04
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