发明名称 Electronic module with metal housing - contains circuit board with semiconductor components and metal strips
摘要 The circuit board (LP) in a metal housing (MG) carries semiconductor components (IC) and metal strips (K2), with at least one semiconductor component in thermal contact with the metal housing. The thermal contact is formed by a transmission body (KG) and the metal strips. The transmission body has a main part and a plunger (St), with the main body arranged for good heat conductive connection to the metal strips. The strips transmit the heat from the circuit board to the metal housing. The plunger is held in the main body such that it is pressed against the semiconductor top side. USE/ADVANTAGE - For dual-in-line, flat-pack and PLCC housings, with flat mounting of the semiconductors on the circuit board and additional cooling effect.
申请公布号 DE4123633(A1) 申请公布日期 1993.01.21
申请号 DE19914123633 申请日期 1991.07.17
申请人 ANT NACHRICHTENTECHNIK GMBH, 7150 BACKNANG, DE 发明人 BETSCH, WOLFGANG, DIPL.-ING. (FH), 7121 INGERSHEIM, DE
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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