发明名称 COMPOUND PRINTED-SUBSTRATE AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To provide the title compound printed-substrate capable of mounting a connector to install inserted parts from both sides escially card substrates and the manufacture thereof in relation to said compound printed-substrate comprising a plurality of multilayer printed-substrates laminated with one another. CONSTITUTION:The title compound printed-substrate is provided with two each of through hole type multilayer printed substrates 1, 3 and a prepreg 2 held by said substrates 1, 3 while the substrate thickness is made larger than the length of the lead pin 10a of inserted parts 10 to be mounted on the substrates 1, 3. At this time, two each of multilayer printed-substrates 1, 3 are connected by a through hole 12 passing through both substrates 1, 3. In such a constitution, holes 6 or setting parts 8 are formed on the positions corresponding to through holes 4, 5 in the prepreg 2 held by said two printed- substrates 1, 3 or the surfaces of the through holes 4, 5 on the prepreg 2 side are sealed with a sealing material 9 and then both multilayer printed-substrates 1, 3 and the prepreg 2 are laminated.</p>
申请公布号 JPH057082(A) 申请公布日期 1993.01.14
申请号 JP19910156785 申请日期 1991.06.27
申请人 FUJITSU LTD 发明人 KODAMA TOSHIRO;SAKURAGI NOBUO;ISHIDA HIDEKI;OSAWA NORIYOSHI;MIYAZAWA HIDEMI
分类号 H05K1/14;H05K1/18;H05K3/46 主分类号 H05K1/14
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