| 摘要 |
<p>PURPOSE:To suppress a generation of noise and uniformize characteristic impedance of signal patterns by a method wherein a ground terminal is connected to a ground layer of an IC package and the ground layer plane is plane- connected to a ground conductive pad provided on the surface of a printed wiring board. CONSTITUTION:Each terminal of a power supply excluding a signal and a ground of an IC chip 2 is connected to a pad 9 on the surface of a printed wiring board 8 through a connecting line 3 between IC packages, an internal conductive pattern 5, and an external lead line 6. Further, each terminal is connected to the other signal terminal and a power supply layer through a conductive pattern 10 within the printed wiring board, respectively. Also, a ground terminal of the IC chip 2 is connected to a package ground layer 1 through the connecting line 3 between the IC packages and an internal ground connecting pattern 11. Thus, it becomes possible to rise a ground potential by a portion of a resistance and inductance exsisting in the external lead line and to suppress a generation of operating noise.</p> |
