| 摘要 |
<p>PURPOSE:To provide an inexpensive method for forming an IC component which has the connecting holes of its base material covered with conductive material to offer a high reliability with little limitation in the thickness of the base material and bump height. CONSTITUTION:A method for forming IC components which comprises the steps of providing copper foils 3 on the one side face of an insulating base material 1 having connecting holes 6 to form a wiring pattern or connecting terminals thereon; facing the side of a circuit surface toward the other side face of the base material 1 and positioning connecting terminals 4 in the connecting holes 6 to mount a chip 2 to the base material; and forcing the copper foil 3 into the corresponding connecting hole 6 of the base material 1 in order to deform it toward the side of the IC chip 2, thereby making possible its connection with the connecting terminal 4 of the IC chip 2.</p> |
