发明名称 PLATING BATH FOR ELECTRODEPOSITION OF ALUMINUM AND PROCESS FOR THE SAME
摘要 In a plating bath for electrodeposition of aluminium, comprising a nonaqueous electrolyte using a eutectic mixture fusible at room temperature, the plating bath comprises a mixture of about 40 to 80 mol % of an aluminum halide and about 20 to 60 mol % of butyl pyridinium halide, or further comprises an organic solvent mixed in said mixture. This plating bath may not cause any color change of a coating into gray or black to assure white and uniform appearance, even when current density is increased to 30 A/dm2 or varied in the range from 0.1 to 30 A/dm2.
申请公布号 CA1311710(C) 申请公布日期 1992.12.22
申请号 CA19870545893 申请日期 1987.09.01
申请人 NISSHIN STEEL CO., LTD. 发明人 KATO, YOSHIO;TAKAHASHI, SETSUKO
分类号 C25D3/44 主分类号 C25D3/44
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