| 摘要 |
A gate array chip (33) has an array (41) of strip-shaped active areas (18) formed on a semiconductor substrate (40). Wiring-dedicated areas (34), each having capacity for two to four wires, are provided between respective adjacent pairs of the active areas (18). In a logic circuit region, one or more active areas (18) are employed as wiring areas. In memory blocks, wiring is performed by employing only the wiring-dedicated areas (34). A master slice integrated circuit manufactured from the gate array chip (33) has a high degree of integration and high operating speed.
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