| 摘要 |
PURPOSE:To eliminate a cause for a bonding defect at the time of mounting an electronic component in a board conveyor for mounting the component on a board. CONSTITUTION:A conveyor belt 2 for placing and conveying a board 1, guide rails 5 for guiding both sides of the board 1, and suction ports 6 provided at the rails 5 and provided oppositely to the side of the board 1, are provided. Cut chips of the board 1 generated by a friction of the board 1 with the rails 5 during conveying, are sucked by the ports 6 thereby to eliminate floating and adherence of the chips to the board 1, and hence a for cause a bonding defect at the time of mounting an electronic component, can be eliminated. |
