| 摘要 |
PURPOSE:To accurately control a profile of an optimal heating temperature for soldering of a printed board on which various surface mounting parts whose sizes of shapes are different are mounted, by an inexpensive and simple device. CONSTITUTION:In the reflow soldering device, plural pieces of temperature sensors 5 of a non-contact type are placed in the peripheral part and the center part of the upper part of a printed board 3, and while carrying the temperature sensors 5 synchronously with the printed board 5, a heating temperature of the printed board 3 in each part of the reflow soldering device is measured and inputted to an arithmetic unit, and by controlling a speed of a conveyor 4 by the arithmetic unit, profile data of the heating temperature of the printed board 3 is held within a standard numerical, range of profile data of an optimal temperature stored in a storage means. In such a way, the quality of soldering of the printed board is improved, and a loss of a switching time which follows switching the kind of a machine can be reduced. |
