发明名称 OUTER-LEAD BONDING APPARATUS
摘要 PURPOSE:To prevent a chip from being damaged by static electricity which is easily generated when a sheet of interlayer paper is stripped off by a method wherein the static electricity generated when the sheet of interlayer paper is stripped from a film carrier is neutralized. CONSTITUTION:The title apparatus is provided with the following: a feed reel 1 on which a film carrier 2 to which a chip P has been bonded is wound together with a sheet of interlayer paper 3; a take-up reel 4 which rolls up the sheet of interlayer paper 3; pitch-feed means 6, 7, M which pitch-feed the film carrier 2 toward a stamping device 5; an ion generation device 12 which generates ions; and an ion blowoff part 13 which is connected the ion generation device 12. The ions are blown off from the ion blowoff part 13 to parts E1, E2 in which the sheet of interlayer paper 3 is stripped from the film carrier 2 extracted from said feed reel 1.
申请公布号 JPH04345093(A) 申请公布日期 1992.12.01
申请号 JP19910118294 申请日期 1991.05.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAWAGUCHI SHINTARO
分类号 H05K13/02 主分类号 H05K13/02
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