摘要 |
PURPOSE:To always ensure a proper clearance between a substrate and an attraction surface when a brazing material is supplied and to provide a nozzle and a method for enabling stable and rapid supply of the brazing material onto the substrate regarding an assembly device for mounting a semiconductor chip and other parts on the substrate in manufacturing a semiconductor device. CONSTITUTION:A device is constituted to secure a proper clearance between a table 4 for a substrate 1 and an attraction surface 71 by bringing a spacer 73 into contact therewith when the attraction surface 71 is lowered onto the table 4 or the substrate 1 whereon a brazing material 3 is mounted.
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