| 摘要 |
<p>PURPOSE:To obtain an electronic-component mounting device whose bonding strength between an outer lead and a pad on an insulating is excellent, which can confirm whether both are bonded well or not and whose heat-dissipating property is excellent. CONSTITUTION:An outer lead 43 on a lead frame 4 is bonded firmly, by using a solder 2, to a pad 13 on an insulating base 1 and to a side-face through hole 12; an island 41 on the lead frame 4 is exposed in a hole 18, for electronic- component mounting use, in the insulating base 1. A support frame 3 which extends between the outer lead 43 and the island 41 is bonded to the rear-side face of the lead frame 4. An electronic component 5 is mounted on the island 41.</p> |
