发明名称 |
DEVICE FOR SEPARATING AND EDGING PRINTED CIRCUIT BOARDS |
摘要 |
<p>The invention relates to a device for separating and edging printed-circuit boards, especially multilayer printed-circuit boards (multilayers) of different format with high dimensional accuracy and speed with little stress to the printed-circuit board, the separation and edging being carried out in one work operation with the profiling of the edges. This is carried out by two circular-saw blades, arranged opposite to one another in a plane, preferably with diamond cutters whose saw-teeth dig into the printed-circuit board on both sides, interlocking with one another - without one of the circular-saw blades separating the printed-circuit board on its own - for separating and edging the printed-circuit boards without any burrs, while at the same time profiling the boards according to the saw-tooth edge profiles. …<IMAGE>… </p> |
申请公布号 |
EP0315739(B1) |
申请公布日期 |
1992.11.25 |
申请号 |
EP19880113095 |
申请日期 |
1988.08.12 |
申请人 |
LOEHR & HERRMANN GMBH |
发明人 |
LOEHR, HANS-GUENTER, DR.-ING.;HERRMANN, GUNTER, DR.-ING.;MOZZI, JOSEF WALTER;CLAUS, DIETER |
分类号 |
B23D45/00;B23D45/10;B23D47/00;B23D47/04;B23D59/00;B23Q1/62;B23Q7/02;B27B33/20;H05K3/00 |
主分类号 |
B23D45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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