| 摘要 |
PURPOSE:To previously perform the retrieval treatment of the position of a pad electrode outside a wiring treatment region, to perform a pad positioning operation with good accuracy on the basis of its retrieval result and to enhance the production yield of a semiconductor device whose density and integartion are made high especially in a wire-bonder for a bonded semiconductor chip. CONSTITUTION:The title apparatus is provided with the following: an image acquisition means 11 which acquires the arrangement image of a semiconductor device 17 and which outputs an arrangement image data D; a storage means 12 which stores said arrangement image data D; a wiring and bonding means 13 which wires and connects said semiconductor device 17; and a control means 14 which controls the input/output operation of said image acquisition means 11, said storage means 12 and said wiring and bonding means 13. The title apparatus is constituted so as to include that said image acquisition means 11 is installed outside the drive part of the wiring and bonding means 13. The title apparatus is constituted so as to include that said control means 14 performs an alignment operation on the basis of the arrangement image data D and that a movement means 15 and a heating means 16 are installed in the said apparatus. |
