| 摘要 |
PURPOSE:To manufacture a copper bonding wire which is not expensive and has loop characteristics equivalent to the characteristics of a gold or gold alloy wire and can be used in place of expensive gold or gold alloy wire. CONSTITUTION:A copper wire whose purity is not less than 99.999% is completely annealed and, after annealing, modified so as to have its 0.2% yield 15-22kg/mm<2> by a skin-pass process with a die. A copper bonding wire which is not expensive and has performance equivalent to the performance of a gold or gold alloy wire can be obtained. |
